Copper busbar

The OC-ETP copper busbar is a fully certified and adhesion-tested tinplated copper busbar, claimed to enhance the performance of switchboards, electrical panels and bus ducts by increasing the lifespan of the end-product through protection against humidity and atmospheric corrosion. Tinplating also provides optimal joint efficiency that prevents oxidation when operating at elevated temperatures or in harsh environments.

The copper busbar has been tested by Testing & Certification Australia's High Power testing station in Lane Cove, Sydney to verify its operating capacity beyond the requirements of local and international standards, including EN 13601, ASTM B 187, AS/NZ 1567 and TIS 408-1982.

Tests included temperature rise, dielectric, short circuit, degree of performance, endurance and arcing fault tests, the results verifying the busbar's higher conductivity, enabling it to operate more safely under duress than the standard ETP copper busbar.

The busbar is made from pure, grade 'A' LME-registered copper cathode and is produced using underwater extrusion manufacturing technology, which gives it a fine grain size and a 50 µm surface roughness for improved surface contact and therefore more energy efficiency over standard ETP copper busbars.

Standard ETP copper busbars are often produced from material containing high levels of impurities that affect the conductivity and bending performance and heighten the risk of cracking and orange-peel surface.